• BUGLabs launches BUGvonHippel module, 3G module coming at CES

    Monday, December 22nd, 2008

    Greg Kumparak is the Mobile Editor at Techcrunch. Greg has been writing for the TechCrunch network since May of 2008. Greg was born just outside of San Jose, and now lives in the East Bay of California. → Learn More

    I’m not sure how many hardcore Java/BUG developers are lurking around these parts, but if any are out there: BUGLabs has a new toy for you.

    As the newest addition to the piece-it-together-and-code-your-own-devices library, the BUGvonHippel lets you connect just about anything with a wired connection to the BUGbase.

    What it supports:

    • Power
    • USB 2.0
    • DAC/li>
    • ADC
    • I2C
    • I/O X
    • GP I/O
    • SPI
    • I2S
    • SERIAL
    • GROUND (x2)

    If you’re curious as to the origins of the name, you’ll want to read up on Eric Von Hippel, Professor at MIT and the inspiration for the device.

    In a bit of not-quite-announced news, BUGLabs also mentioned that we ought to expect a couple of new modules on the floor (or “Test Kitchen”, as they call it) at CES, including one for 3G wireless support.

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