Qualcomm releases first batch of next year's chips


Qualcomm, one of the largest fabless mobile chip manufactures in the world, has announced the availability of samples of its next-gen dual-carrier HSPA+ and multi-mode 3G/LTE chipsets. Hello Future!

So, what’s the big deal? According to Qualcomm,

These chipsets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation network technologies that bring more advanced data capabilities to mobile devices for new global markets in addition to North America. Dual-carrier HSPA+ and LTE are network innovations that provide the ability to deliver more advanced data capabilities to mobile devices, supporting more compelling applications and richer user experiences.

Essentially, these new chipsets will enable handset manufacturers to make “future-proof” devices (as if!) that are capable of operating on today’s 3G networks, and tomorrow’s 4G networks. In theory, this will help both carriers and consumers alike. Customers will have more confidence in purchasing new phones, knowing that they won’t be obsolete the minute the carriers flip the switches on their next-gen 4G networks. In turn, this will also help the carriers avoid any major disruption in hardware sales as they continue to roll out/expand their 4G networks.

Sounds great, doesn’t it? Too bad we won’t see any devices using this new equipment until at least the second half of 2010. But, on the bright side, it is good to know that Qualcomm is working with numerous network operators, infrastructure vendors and device manufacturers around the world to get these next-gen networks and devices off the drawing board and into the real world.