NEC Electronics today announced in Japan [JP] they managed to develop a technology which could lead to chips used for wireless applications that are 10% smaller than existing products.
NEC is planning to use the new chips for indoor wireless communication under gigahertz-band frequencies and miliwave and UWB protocols. The company coats their chips with a ferrite layer that boosts the magnetic field, which coils placed on the chips generate to attenuate electromagnetic noise. As a result, coils can be cut down in size, which leads to smaller chips.
NEC says they plan to begin mass production by 2011. The chips were presented to the general public two days ago at the 2008 International Conference on Solid State Devices and Materials in Tokyo
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