Japanese joint venture project paves way for ultrathin gadgets

Friday, May 23rd, 2008

Dr. Serkan Toto currently works as the first and only Asia-based writer for the TechCrunch network, mainly covering Japan-related technology and web companies for TechCrunch, CrunchGear and MobileCrunch. Serkan also works full-time as an independent web and mobile industry consultant with a focus on the Japanese market. He is sept-lingual, holds an MBA and is a PhD in economics. Serkan... → Learn More


A joint venture project carried by a number of Japanese Tech powerhouses like Matsushita, Sharp, Toshiba and Hitachi apparently developed a technology to integrate system chips into LCD panels.

Japanese media today report that researchers managed to embed the electronic circuits of chips with glass sheets used for LCD screens, resulting in a device just 0.7 mm thick. The technology is said to eliminate the usage of circuit boards, which also leads to lower production costs of electronic devices.

The researchers involved in the project currently plan to apply the technology to develop ultrathin cell phones first. Large-size LCD screens for TVs and OLED displays are targeted for a later phase.

The companies and academic institutions behind the joint venture hope to commercialize the new technology in about 5 years. The project is financed with $115 million.

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